| Title: | MATERIALS FOR ELECTRONIC PACKAGING |
| Authors: | Deborah D.l. Chung, Editor |
| Material Type: | printed text |
| Publisher: | Boston MA : Butterworth-Heinemann, 1995 |
| ISBN (or other code): | 978-0-7506-9314-1 |
| Size: | xiv-368 p. / 25 cm |
| Languages: | English |
| Class number: | MATE (MATERIAUX) |
| Keywords | Composite materials , Electronics , Materials , Microfabrication |
Copies (1)
| Barcode | Call number | Media type | Location | Section | Status | Commentaire |
|---|---|---|---|---|---|---|
| 008128 | MATE3 CHU | papier | CNRS | MATE (MATERIAUX) | Available |
