| Title: | POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION : Developed from a symposium sponsored by the Divisions of Polymeric Materials : Science and Engineering and of Polymer Chemistry, Inc., at the 196th national meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988 |
| Authors: | John H. Lupinski, Author ; Robert S. Moore |
| Material Type: | printed text |
| Publisher: | Washington DC : American Chemical Society, 1989 |
| Series: | ACS Symposium Series, num. 407 |
| ISBN (or other code): | 978-0-8412-1679-2 |
| Size: | xii-499 p. / 24 cm |
| Languages: | English |
| Class number: | MATE (MATERIAUX) |
| Keywords | Compounds , Dielectrics , Electronics , Polymers |
Copies (1)
| Barcode | Call number | Media type | Location | Section | Status | Commentaire |
|---|---|---|---|---|---|---|
| 007217 | MATE5 LUP/C | papier | CNRS | MATE (MATERIAUX) | Available |
